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        當前位置:主頁 > 產品中心 > 主控芯片

        RK3368

        RK3368 is a low power, high performance octal-core Cortex-A53 processor for mobile phones
        型號:RK3368
        品牌:ROCKCHIP
        封裝:TFBGA453
        批號:15+
        庫存:700

        規格書(Datesheet):RK3368.PDF 點擊下載

        商品信息

                  RK3368 is a low power, high performance processor for mobile phones, personal mobile internet device and other digital multimedia applications, and integrates octal-core Cortex-A53 with separately NEON coprocessor. (點擊即可咨詢芯片詳細信息

        RK3368’s Features
        1、 MicroProcessor
        - Octal-core ARM Cortex-A53 MPCore processor, a high-performance,
        low-power and cached application processor
        - Two CPU clusters, with four CPU core for each cluster, One cluster is
        optimized for high-performance(big cluster) and the other is optimized for
        low power(little cluster)
        - Full implementation of the ARM architecture v8-A instruction set, ARM Neon
        Advanced SIMD (single instruction, multiple data) support for accelerated
        media and signal processing computation
        - ARMv8 Cryptography Extensions
        - In-order pipeline with symmetric dual-issue of most instructions.
        - Harvard Level 1 (L1) memory system with a Memory Management Unit
        (MMU).
        - Level 2 (L2) memory system providing cluster memory coherency, including
        an L2 cache.
        - Include VFP v3 hardware to support single and double-precision add,
        subtract, divide, multiply and accumulate, and square root operations
        - SCU ensures memory coherency between the four CPUs
        - CCI400 ensures the memory coherency between the two clusters
        - Integrated 32KB L1 instruction cache , 32KB L1 data cache with 4-way set
        associative
        - 512MB unified L2 Cache for big cluster, 256KB unified L2 Cache for little
        cluster
        - Trustzone technology support
        - Full coresight debug solution
        - Ten separate power domains for every core to support internal power switch
        and externally turn on/off based on different application scenario
        - One isolated voltage domain to support DVFS
        - Maximum frequency can be up to 900MHz@0.9V for Cortex-A53 big cluster
        - Maximum frequency can be up to 750MHz@0.9V for Cortex-A52 little
        cluster
        2、 Memory Organization
        - Internal on-chip memory
        - External off-chip memory①
        3、Internal Memory
        - Internal BootRom
        - Internal SRAM
        4、External Memory or Storage device
        - Dynamic Memory Interface (DDR3/DDR3L/LPDDR2/LPDDR3)
        - Nand Flash Interface
        - eMMC Interface
        - SD/MMC Interface
        5、System Component
        - CRU (clock & reset unit)
        - PMU(power management unit)
        - Timer
        - PWM
        - WatchDog
        - Bus Architecture
        - Interrupt Controller
        - DMAC
        - Security system
        6、 Video CODEC
        - Shared internal memory and bus interface for video decoder and encoder②
        - Embedded memory management unit(MMU)
        - Video Decoder
        - Video Encoder
        7、 HEVC Decoder
        - Main/Main10 HEVC/H.265 decoder
        - 4k@60FPS (core clock@300Mhz)
        - Support up to 4096x2304 resolution
        - Support up to 100Mbps bit rate
        - Embedded memory management unit(MMU)
        - Stream error detector (28 IDs)
        - Internal 128k cache for bandwidth reduction
        - Multi-clock domains and auto clock-gating design for power saving
        8、 JPEG CODEC
        - JPEG decoder
        - JPEG encoder
        9、 Image Enhancement
        - Image pre-processor
        - Video stabilization
        - Image Post-Processor (embedded inside video decoder)
        10、 Graphics Engine
        - 3D Graphics Engine :
        - Base handheld architecture fully Microsoft® DirectX™ 9.3, OpenGL®
        3.1, and OpenGL ES 3 compliant
        - Support for pull-model attribute evaluation
        - Tile-based deferred rendering architecture with concurrent processing
        of multiple tiles
        - Multi-threaded Unified Shading Cluster (USC) engine
        11、Video IN/OUT
        - Camera Interface(interface only)
        - Camera Interface and Image Processer(Interface and Image Processing)
        - Display Interface
        12、HDMI
        - Single Physical Layer PHY with support for HDMI 1.4 and 2.0 operation
        - Support HDCP 1.4
        - Support HDCP 2.2
        13、MIPI_DSI/LVDS/TTL combo PHY
        - MIPI_TX
        - LVDS
        - TTL
        14、MIPI_CSI PHY
        - Embedded one MIPI_CSI PHY
        - Support 4 data lane, providing up to 4Gbps data rate
        15、eDP PHY
        - Support 4Kx2K @ 30fps
        - Compliant with eDP TM Specification, version 1.1
        - Up to 4 physical lanes of 2.7/1.62 Gbps/lane(HBR2/HBR/RBR)
        - RGB, YCbCr 4:4:4, YCbCr 4:2:2 and 8/10/12 bit per component video format
        - Encoded bit stream (Dolby Digital, or DTS) – IEC61937 compliant
        - Support VESA DMT and CVT timing standards
        - Fully support EIA/CEA-861D video timing and Info Frame structure
        - Hot plug and unplug detection and link status monitor
        - Support DDC/CI and MCCS command transmission when the monitor
        includes a display controller.
        - Supports Panel Self Refresh(PSR)
        16、 Audio Interface
        - I2S/PCM with 8ch
        - I2S/PCM with 2ch
        - SPDIF
        17、 Connectivity
        - SDIO interface
        - High-speed ADC stream interface
        - TS interface
        - Smart Card
        - GMAC 10/100/1000M Ethernet Controller
        - SPI Controller
        - Uart Controller
        - I2C controller
        - GPIO
        - USB Host2.0
        - USB OTG2.0
        - HSIC Interface
        18、 Others
        - Temperature Sensor(TS-ADC)
        - SAR-ADC(Successive Approximation Register)
        - eFuse
        - Operation Temperature Range:-40C to +85C
        - Operation Voltage Range:Core supply: 1.0V (±10%) IO supply : 3.3V or 2.5V or 1.8V (±10%)
        - Process :GlobalFoundry 28nmSLP
        - Package Type
                          TFBGA453LD(body: 19mm x 19mm; ball size: 0.4mm; ball pitch:0.8mm)
         
        RK3368’s Block Diagram
         RK3368's Block Diagram
        RK3368’s Package

         RK3368's PackageRK3368's Package

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